Sequential Lamination Technology

Power design services uses advanced sequential lamination technology allowing the manufacture of printed circuit boards pcb as the composition of different subsets of boards and layers.

Sequential lamination technology. The backbone of pcb fabrication the most fundamental manufacturing technique in modern pcb fabrication is sequential lamination. Tarun amla isola s executive vice president and chief technology officer commented we are pleased that apct and speeding edge have endorsed i speed s thermal performance caf mitigation sequential lamination and signal integrity. We use sbu technology which allows sequential addition of more pairs of layers to form a multilayer core to create this type of highly integrated pcb. With flexible staffing and pricing options we build tailored solutions that lower operating costs and scale to match enterprise growth or temporary resource.

Common sequential lamination approach. Sub parts or sub composites that have been laminated to additional copper or other sub parts. The subsets of the multi layer pcbs are created in separate processes. Sequential lamination technology for high performance multi layer pcbs.

This is due to the nature of the very small drill and the aspect ratio requirement on all drills example 10 1 down to the inner layer. This is a well understood technology and not covered in this note. After this a dielectric substance is interposed between each pair of subsets. Sequential technology international designs and executes modern reliable brand aligned customer experiences that directly address the most complex business process challenges facing mid market and.

Sequential lamination of pcb layers is required in order to connect outer surface vias. This material is a cost effective efficient solution for many of today s advanced pcbs. Hdi is one of the more complex board fabrication processes we specialize in. Sequential lamination technology is used if the pcb comprises two or more subsets.

High layer count hdi. Thicker center subpart 6 26 layers typically with 1 2 sequentially applied circuit layers on each side. The layers are attached by microvia. The center cores have drilled plated through holes.

Simply put this term describes the process of building up a pcb layer by layer using multiple subcomposites of copper and insulating pcb laminate material this technique allows for the completion of complex tasks such as trace routing on. We combine expertise and technology to help you deliver best in class customer experience. A pcb subset is a multilayer printed circuit board presented in an almost completed pcb process. Sequential laminated printed circuit boards pcbs go through at least two laminate cycles and can go through more the resulting structure is then submitted to the required additional pcb.

Sequential lamination is a multi layer pcb technology. This process is usually associated with via in pad technology when routing fine pitch densely routed designs.